Wafer Ring

Stainless steel and plastic wafer rings for semiconductor dicing, taping and die bonding processes.

Wafer Ring

Product Overview

Our wafer rings are precision-engineered for semiconductor packaging, dicing and die bonding processes. Manufactured from high-grade SUS420J2 stainless steel or lightweight anti-static plastic, these rings serve as secure outer frames during wafer grinding and dicing operations. With high flatness, hardness and corrosion resistance, our wafer rings can be repeatedly cleaned and recycled — making them both environmentally friendly and cost-effective.

Applications

Wafer DicingWafer TapingDie BondingWafer GrindingSemiconductor Packaging

Key Features

High flatness and hardness for precise wafer positioning
Excellent bending and corrosion resistance
Superior scratch protection for wafer edges
Reusable and recyclable — environmentally friendly and cost-effective
Available in 6", 8" and 12" sizes to match standard wafer diameters
Compatible with blue tape and wafer dicing machines

Product Types

8" Wafer Ring

8" Wafer Ring

Stainless steel wafer ring for 8-inch (200mm) wafers. Used in semiconductor packaging, taping and dicing processes as the outer frame during wafer grinding and cutting. Can be directly shipped after dicing.

Product CodeXH-M200
Dimensions290(L) x 290(W) x 1.5(H) mm
Weight200g
Capacity1 PCS
Wafer Size8 inch (Φ200mm)
MaterialSUS420J2
8" Plastic Frame

8" Plastic Frame

Lightweight anti-static plastic frame for 8-inch wafers. Designed for use with wafer dicing machines, providing secure wafer fixation during grinding and dicing. Features lightweight construction and anti-static properties.

Product CodeXH-P200
Dimensions290(L) x 290(W) x 1.5(H) mm
WeightLightweight (plastic)
Capacity1 PCS
Wafer Size8 inch (Φ200mm)
MaterialAnti-Static Plastic
6" Wafer Ring

6" Wafer Ring

Stainless steel wafer ring for 6-inch (150mm) wafers. Used in semiconductor packaging, taping and dicing processes. High flatness and hardness with excellent corrosion resistance and scratch protection.

Product CodeXH-M150
Dimensions230(L) x 230(W) x 1.5(H) mm
Weight150g
Capacity1 PCS
Wafer Size6 inch (Φ150mm)
MaterialSUS420J2
12" Wafer Ring

12" Wafer Ring

Stainless steel wafer ring for 12-inch (300mm) wafers. Used in semiconductor packaging, taping and dicing processes. Manufactured from SUS420J2 with high flatness, hardness and corrosion resistance.

Product CodeXH-M300
Dimensions380(L) x 380(W) x 1.5(H) mm
Weight300g
Capacity1 PCS
Wafer Size12 inch (Φ300mm)
MaterialSUS420J2

Available Materials

SUS420J2 Stainless SteelAnti-Static Plastic

Technical Specifications

ParameterSpecification
Available Sizes6", 8", 12"
MaterialsSUS420J2 Stainless Steel, Anti-Static Plastic
Thickness1.5mm
HardnessHRC50-55

Customization Available

Customized specifications are available according to customer requirements. Contact us to discuss your specific needs.

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